姓 名 | 王桂蓮 | 性 別 | 女 |
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職 稱 | 副教授 | |||
研究方向 | MEMS傳感器, 微電子封裝，有限元分析，多目標優化等 | |||
通訊地址 | 上海市松江區龍騰路333號行政樓808室 | |||
郵政編碼 | 201620 | |||
聯系電話 | 021-67791084 | |||
電子郵箱 | wglwrc2016@126.com | |||
個 人 介 紹 | 王桂蓮，畢業於上海交通大學，現於恒达娱乐電子信息系從事教學和科研工作。主持國家自然基金青年項目1項，橫向課題3項，參與國家重大項目1項、國家自然科學基金面上項目1項，在Advanced Materials、Small等國際頂級期刊發布高水平論文30余篇，其中以第一作者發布的SCI 9篇，高被引ESI論文1篇，發明專利授權4項。
主要研究成果： [1] Guilian Wang, Guifu Ding, Rui Liu, Dongdong Xie, Yongjin Wu, Xiaodan Miao.Multi-objective optimization of a bidirectional-ribbed microchannel based on CFD and NSGA-II genetic algorithm. International Journal of Thermal Sciences, 181 (2022) 107731. (SCI收錄) [2] Guilian Wang, Tao Chen, Mingfei Tian. Fluid and heat transfer characteristics of microchannel heat sink with truncated rib on sidewall. International Journal of Heat and Mass Transfer, Vol. 148, 119142, 2020. (SCI二區收錄) [3]Guilian Wang, Qian Nan, Guifu Ding, Heat transfer enhancement in microchannel heat sink with bidirectional rib,International Journal of Heat and Mass Transfer,Vol. 136, 597-609, 2019. (SCI二區收錄，高被引論文) [4]Guilian Wang, C, Rui Liu, Jiangbo Luo, Di Niu, Junhong Zhao, Xiaolin Zhao and Yan Wang. Design, simulation and fabrication of a flexible bond pad (FBP) with hollow annular protuberance to improve the thermal fatigue lifetime for Through Silicon Vias (TSVs), Journal of Micromechanics and Microengineering, Vol. 24, 125078, 2014. (SCI收錄) [5] Guilian Wang, Di Niu, Fuqiang Xie, Yan Wang, Xiaolin Zhao and Guifu Ding. Experimental and numerical investigation of a microchannel heat sink (MCHS) with micro-scale ribs and grooves for chip cooling, Applied Thermal Engineering, Vol. 85, pp. 61-70, 2015. (SCI二區收錄) [6] Guilian Wang, Guifu Ding and Xiaodan Miao. On-resistance reduction of vertical double diffusion metal oxide semiconductor devices with external stress, Micro Nano Letter, 2016 (SCI收錄) | |||
